Tuesday, July 22, 2014
3D
Stacked Die Are Coming Soon.
Wang said that for a 100mm² die, yield drops from 500 good chips per wafer at 28nm to 419 at 7nm. For a large, complex 400mm² die, the yield drops from 63 to 31.
In contrast, yields are significantly higher using smaller die packaged together compared with one highly integrated large die.
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99% BAD HARDWARE WEEK:
Wang said that for a 100mm² die, yield drops from 500 good chips per wafer at 28nm to 419 at 7nm. For a large, complex 400mm² die, the yield drops from 63 to 31.
In contrast, yields are significantly higher using smaller die packaged together compared with one highly integrated large die.
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99% BAD HARDWARE WEEK:
THIS LINK posted by Joseph Bell : 7:35 PM
